“3D NAND ‘COP’ technology, well-priced competitiveness.”
The 3D NAND cost will be closed to HDD
May of 11th, 2016
NH investment & Securities analyst said “one of the directions of 3D NAND technology is COP tech that forms the Peri structure that controls the semiconductor memory storage cell.
You can explain if 3D NAND were general Apartment, COP structure would be Apartment residential complex.
Now, Intel, Micron accepted COP, however Toshiba, Samsung, SK Hynix will also accept the technology to their own.
World’s first production of 3-bit three-dimensional V NAND flash memory by Samsung.
The analyst said “COP might be helpful for the cost of 3D NAND and also reduce the size of 3D NAND because Peri takes 30% of 3D NAND area. Also “the reason why Micron claims that they have predominance in competition in semiconductor industry is they are able to reduce the chip size using COP technology.
3D NAND makers predict that in the industry, Tik Tok strategy will be used through COP technology.
The strategy of Tik Tok is evolving micro process every 2years then improve the architecture.
In addition, The analyst also mentioned “this year, increase the number of stacks, next year, able to accept COP structure” also “if MLC, TLC, QLC is able to be accept, the cost of 3D NAND would be faster to reach HDD.
source of inews(www.inews24.com)