High Performance
Test Sockets

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Leaded

SIP
DIP
ZIP
SOP
QFP

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Leadless

QFN
LCC
DFN
MLF
.

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Grid Array

BGA
CSP
LGA
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POP

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WLCSP

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ICT

Camera
LCD
Sensor
FPC/PCB

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Standard Socket

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Floating Base

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Flat Top

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Integral Lid

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Multi Sites

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Clamping(Spring)

Clamping(Handler)

Clamshell(Handler)

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Clamping(Lever)

Clamping((Fan-Heat)

Model: 11-000004-01

Package Type: BGA
Socket Type: Socket Frame
Contact Type: Probe Pin
Contact Count: 1,200EA
Size: 59 x 75mm
Pitch: 0.8mm
Material: SST, Vespel

50ohm controlled impedance
High speed and high performance
Developed ≥ 0.8 mm pitch
Patented technology
outstanding thermal properties

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Model: 11-000005-01

Package Type: BGA
Socket Type: Flat Top
Contact Type: Probe Pin
Contact Count: 1,200EA
Size: 59x 75mm
Pitch: 0.8mm
Material: Ceramic Peek

50ohm controlled impedance
High speed and high performance
Developed ≥ 0.8 mm pitch
Patented technology
Outstanding thermal properties

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Model: 15-000001-01

Model: 15-000001-01
Package Type: ICT(Sensor)
Socket Type: Integral Lid
Contact Type: Probe Pin
Contact Count: 15EA
Size: 50x 83mm
Pitch: 0.6mm
Material: Al, Torlon, Ceramic Peek, Ultem

50ohm controlled impedance
High performance
Developed ≥ 0.6 mm pitch
Patented technology
Outstanding EMI Protection technology

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Model: 15-000002-01

Package Type: ICT(Camera Module)
Socket Type: Integral Lid
Contact Type: Probe Pin
Contact Count: 24EA
Size: 55x 50mm
Pitch: 0.4mm
Material: Al, Torlon, Unilate, Acetal, Ultem

50ohm controlled impedance
Developed ≥ 0.4 mm pitch
Patented technology
Outstanding EMI Protection technology

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Model: 15-000003-01

Package Type: ICT(Camera Module)
Socket Type: Multi Sites
Contact Type: Probe Pin
Contact Count: 4x 24EA
Size: 160x 90mm
Pitch: 0.4mm
Material: Al, Torlon, Acetal, Ultem

50ohm controlled impedance
Developed ≥ 0.4 mm pitch
Patented technology
Outstanding thermal properties and EMI protection

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Model: 16-000001-01

Package Type: ICT(FPC)
Socket Type: Standard
Contact Type: Probe Pin
Contact Count: 8EA
Size: 24x 12mm
Pitch: 0.5mm
Material: Al, Torlon, Ceramic Peek

50ohm controlled impedance
High performance
Developed ≥ 0.8 mm pitch
Patented technology
Outstanding EMI protection

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Model: 16-000002-01

Package Type: ICT(LCD)
Socket Type: Standard
Contact Type: Probe Pin
Contact Count: 197EA
Size: 104x 10mm
Pitch: 1.0mm
Material: Al, Ultem

50ohm controlled impedance
High performance
Developed ≥ 1.0 mm pitch
Patented technology

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Model: 32-000002-01

Package Type: BGA
Lid Type: Clamping(Handler)
Size: 75x 59mm
Material: Al, Torlon, Peek, Ultem

50ohm controlled impedance
High speed and high performance
Developed ≥ 0.8 mm pitch
Patented technology
Outstanding thermal properties
Outstanding EMI protection Technology

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